Non-contact LSI-package solder-joint inspection method using an electro-optic probe

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3582, Issue , 1998, Pages 132-137

  Yojima, Masayuki ^a   Kuzumi, Hajime ^a   Nishiyama, Takeshi ^a  

^a NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ACTUATORS; ELECTROOPTICAL DEVICES; INSPECTION; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUIT TESTING; LSI CIRCUITS; PROBES; SOLDERED JOINTS;

ELECTROOPTIC PROBES; SOLENOID-ACTUATOR PROBE;

ELECTRONICS PACKAGING;

EID: 0032306162     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)