Delamination strength of Cu thin film characterized by nanoscale stress field near interface edge

Nippon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 68, Issue 1, 2002, Pages 119-125

  Kitamuma, Takayuki ^a   Hirakata, Hiroyuki ^b   Itsuji, Takashi ^b  

^a KYOTO UNIVERSITY   (Japan)

^b NONE

Author keywords

Copper film; Delamination; Fracture toughness; Interface edge; Interface strength; Nanomechanics; Stress concentration; Thin film

Indexed keywords

COPPER; CRACK INITIATION; DELAMINATION; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); SILICON; STRENGTH OF MATERIALS; STRESS CONCENTRATION; TITANIUM NITRIDE;

DELAMINATION TESTS; FILM THICKNESS; FREE EDGE; INTERFACE STRENGTH; NANOMECHANICS;

THIN FILMS;

EID: 0036448365     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.68.119     Document Type: Article

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