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Volumn 5231, Issue , 2003, Pages 217-222

Microfluidics for thermal management: Applications, fabrication, and demonstration in LTCC

Author keywords

Capillary pumped loop; Embedded cavities; Microfluidics; Micropower generation; Thermal management

Indexed keywords

COOLING; ELECTRONICS PACKAGING; HEAT FLUX; HERMETIC DEVICES; POWER GENERATION; RELIABILITY; THERMODYNAMIC STABILITY;

EID: 0041828726     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (11)
  • 2
    • 85072478075 scopus 로고    scopus 로고
    • Miniature embedded heat pipes in low temperature co-fired ceramic for electronic devices requiring temperature stability
    • paper # 2000-01-3621
    • Steven Snyder, C. M. Newton, and M. Lange, "Miniature Embedded Heat Pipes in Low Temperature Co-Fired Ceramic for Electronic Devices Requiring Temperature Stability", SAE Power Systems Conference, October 2000, San Diego, CA, paper # 2000-01-3621.
    • SAE Power Systems Conference, October 2000, San Diego, CA
    • Snyder, S.1    Newton, C.M.2    Lange, M.3
  • 7
    • 0032299361 scopus 로고    scopus 로고
    • The measurement and control of sagging in meso electromechanical LTCC structures and systems
    • J. Espinoza-Vallejos, et.al, "The Measurement and Control of Sagging in Meso Electromechanical LTCC Structures and Systems" MRS Conference Proceedings 518 pp. 73-79, 1998.
    • (1998) MRS Conference Proceedings 518 , pp. 73-79
    • Espinoza-Vallejos, J.1
  • 8
    • 4243415334 scopus 로고    scopus 로고
    • Embedded hermetic cavity fabrication in low temperature cofire ceramic
    • U.S. Patent Pending
    • Brian Smith, R. Pike, M. Newton "Embedded Hermetic Cavity Fabrication in Low Temperature Cofire Ceramic" U.S. Patent Pending
    • Smith, B.1    Pike, R.2    Newton, M.3
  • 9
    • 25744466732 scopus 로고    scopus 로고
    • Electronic module including a cooling substrate having a fluid cooling circuit therein and related methods
    • U.S. Patent 6,452,798 September 17
    • Brian Smith, R. Rumpf, M. Newton "Electronic Module Including a Cooling Substrate Having a Fluid Cooling Circuit Therein and Related Methods" U.S. Patent 6,452,798 September 17, 2002
    • (2002)
    • Smith, B.1    Rumpf, R.2    Newton, M.3
  • 10
    • 0003434994 scopus 로고
    • Heat pipe science and technology
    • Taylor & Francis, Washington D.C
    • A. Faghri, "Heat Pipe Science and Technology" Taylor & Francis, Washington D.C, 1995
    • (1995)
    • Faghri, A.1
  • 11
    • 0027390982 scopus 로고
    • Experimental investigation of micro heat pipes fabricated in silicon wafers
    • G.P Peterson, A. Duncan, and M. Weichold "Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers" Journal of Heat Transfer, Vol 115, pp. 751-756, 1993
    • (1993) Journal of Heat Transfer , vol.115 , pp. 751-756
    • Peterson, G.P.1    Duncan, A.2    Weichold, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.