Development and Testing of a Planar, Silicon Mini-Capillary Pumped Loop

American Society of Mechanical Engineers, Micro-Electromechanical Systems Division Publication (MEMS)

Volumn 3, Issue , 2001, Pages 93-98

  Pettigrew, Kenneth ^a   Smith, Brian ^b   Yerkes, Kirk ^c   Gamlen, Carol ^b   Liepmann, Dorian ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b National Center for Health Statistics   (United States)

^c AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPILLARY PUMPED LOOP (CPL); THERMAL CONTROLS;

BONDING; CALORIMETERS; COOLING; EVAPORATORS; HEAT FLUX; HYDRAULICS; INSULATED GATE BIPOLAR TRANSISTORS; PHOTORESISTORS; PLASMA ETCHING; SILICON WAFERS; TEMPERATURE CONTROL;

MICROELECTROMECHANICAL DEVICES;

EID: 1542747877     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. Dickey, J.T., and Peterson G.P. 1994,"Experimental and Analytical Investigation of a Capillary Pumped Loop," Journal of Thermophysics and Heat Transfer, Vol 8, No. 3, pp 602-607
2. Faghri, A., 1995, Heat Pipe Science and Technology, Tayler & Francis, Washington D.C.
3. Hoelke, A. Henderson, H.T., Gerner F. M., Kazmierczak, M., 1999 "analysis of the Heat Transfer Capacity of a Micromachined Loop Heat Pipe," Proceedings of the ASME Heat Transfer Division, HTD-Vol. 364-3 pp. 53-60.
4. Kirshberg, J., Yerkes, K., and Liepmann, D., 1999 "Micro-Cooler for Chip-Level Temperature Control," SAE Aerospace Power Systems Conference, P-341
5. Ku, J., 1999 "Operating Characteristics of Loop Heat Pipes" SAE 29th International Conference on Environmental Systems. 1999-01-2007.
6. Peterson, G.P., Duncan, A.B., and Weichold, M.H., 1993, "Experimental Investigation of Micro Heat Pipes Fabricated in Silicon Wafers," Journal of Heat Transfer, Vol 115, pp. 751-756.
7. Pettigrew, K., Kirshberg J., Yerkes, K., Trebotich, D. Liepmann, D., 2001 "Performance of a MEMS based Micro Capillary Pumped Loop for Chip-Level Temperature Control," IEEE MEMS 2001 Conference, P-427