Demonstration of a micro-CPL based on MEMS fabrication technologies

Proceedings of the Intersociety Energy Conversion Engineering Conference

Volumn 2, Issue , 2000, Pages 1198-1204

  Kirshberg, Jeffrey ^a   Yerkes, Kirk L ^b   Liepmann, Dorian ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b AIR FORCE RESEARCH LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING; ELECTRONICS PACKAGING; EVAPORATORS; HEATING; INTEGRATED CIRCUIT MANUFACTURE; LASER APPLICATIONS; SEMICONDUCTING GLASS; SILICON WAFERS;

BOROFLOAT GLASS WAFER; ELECTRONIC COOLING; LASER SPOT HEATING; MICROCAPILLARY PUMPED LOOP;

MICROELECTROMECHANICAL DEVICES;

EID: 0033696261     PISSN: 0146955X     EISSN: None     Source Type: Journal    
DOI: 10.1109/IECEC.2000.870931     Document Type: Article

References (7)

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3. J. Kirshberg K. Yerkes D. Liepmann Micro-Cooler for Chip-Level Temperature Control SAE Aerospace Power Systems Conference 341 SAE Aerospace Power Systems Conference 1999
4. A. Faghri Heat Pipe Science and Technology 1995 Taylor & Francis Washinton D.C.
5. J. T. Dickey Experimental and Analytical Investigation of a Capillary Pumped Loop Journal of Thermophysics and Heat Transfer 8 3 602 607 1994
6. R. D. Blevins Applied Fluid Dynamics Handbook 1984 Van Nostrand Reinhold Company New York
7. J. Kirshberg K. Yerkes D. Liepmann Micro-Cooler for Chip-Level Temperature Control SAE Aerospace Power Systems Conference 341 SAE Aerospace Power Systems Conference 1999