Miniature embedded heat pipes in low temperature Co-fired ceramic for electronic devices requiring temperature stability

SAE Technical Papers

Volumn , Issue , 2000, Pages

  Snyder, Steven R ^a   Newton, C Michael ^a   Lange, Michael ^a  

^a National Center for Health Statistics

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; MICROELECTRONICS; POWER MOSFET; TEMPERATURE;

ELECTRONIC DEVICE; EMBEDDED HEAT PIPES; EVAPORATOR AND CONDENSERS; INDEPENDENT MODEL; JUNCTION TEMPERATURES; LOW TEMPERATURE CO-FIRED CERAMICS; MINIATURE HEAT PIPES; TEMPERATURE STABILITY;

HEAT PIPES;

EID: 85072478075     PISSN: 01487191     EISSN: 26883627     Source Type: Journal    
DOI: 10.4271/2000-01-3621     Document Type: Conference Paper

References (3)

1. Cao, Y., Faghri, A., and Mahefkey, E.T., "Micro/Miniature Heat Pipes and Operating Limitations" HTD-Vol. 236, Heat Pipes and Capillary Pumped Loops, ASME (1993).
2. Zampino, M., and Jones, W.K., "Substrate Embedded Heat Pipes Compatible with Cofire Processing" Proc. Int. Sym. Of Microelectronics, IMAPS, Philadelphia (1997).
3. Faghri, A., Heat Pipe Science and Technology, Taylor & Francis (1995).