A critical analysis of techniques and future CD metrology needs

Solid State Technology

Volumn 46, Issue 7, 2003, Pages 63-64+66+68+70

  Diebold, Alain C ^a   Joy, David ^b  

^a SEMATECH   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMIC FORCE MICROSCOPY; ELECTRON BEAMS; ELECTRONS; GATES (TRANSISTOR); PROBES; SCANNING; SCANNING ELECTRON MICROSCOPY;

CRITICAL DIMENSION MEASUREMENT; SCATTEROMETRY;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0041811796     PISSN: 0038111X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (13)

1. D.C. Joy, The Future of the CD-SEM, Microlithography World, August 2002, pp. 4-6.
2. A.C. Diebold, IEEE Transaction on Semiconductor Manufacturing, 15, pp. 169-182, 2002.
3. The Requirements and Limits of Metrology Technology, Proceedings of the 2003 International conference on Characterization and Metrology for ULSI Technology, Austin, March 24-28, 2003, to be publish in late 2003.
4. K. Patterson, et al., Metrology, Inspection, and Process Control for Microlithography XV, SPIE Vol. 4344, 2001, pp. 809-814.
5. A. Vladar, M. Postek, report to ISMT Metrology Council, June 2001.
6. P.E. Batson, et al., Nature 418 617, 2002.
7. M. Sato, F. Mizuno, Proceedings EIPBN 2000, (Palm Springs: CA), pp. 35-40.
8. S. Villarrubia, et al., Proc. SPIE 4689, (2002).
9. F. Mizuno, S. Yamada, J. Vac. Sci. Technol. B 13, (1995), pp. 2682-2687.
10. O.C. Wells, Scanning Electron Microscopy, (McGrawHill, NY).
11. J. Zach, M. Haider, Nucl. Instrum. and Methods, A363, pp. 319-329.
12. S. Joens, Micros. and Microanalysis, 7, Suppl. 2, pp. 875-876.
13. F. Terry, private communication and presentation at the July 2002 Metrology Technical Working Group meeting.