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Volumn 107, Issue 1, 2003, Pages 50-56

A silicon micromachined shock accelerometer with twin-mass-plate structure

Author keywords

Accelerometer; Micromachining; Piezoresistive; Shock

Indexed keywords

FABRICATION; MICROMACHINING; PLATES (STRUCTURAL COMPONENTS); SILICON;

EID: 0041780948     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(03)00270-X     Document Type: Article
Times cited : (32)

References (9)
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  • 2
    • 0029308777 scopus 로고
    • Fabrication and characterization of high-g-force, silicon piezoresistive accelerometers
    • Y. Ning, Y. Loke, G. McKinnon, Fabrication and characterization of high-g-force, silicon piezoresistive accelerometers, Sens. Actuators A 48 (1995) 55-61.
    • (1995) Sens. Actuators A , vol.48 , pp. 55-61
    • Ning, Y.1    Loke, Y.2    McKinnon, G.3
  • 4
    • 84964558104 scopus 로고    scopus 로고
    • A simple method for primary testing of the micromachining piezoresistive accelerometer with a range more than kilo-g
    • Shanghai, China, October
    • Quanping Huang, Deren Lu, A simple method for primary testing of the micromachining piezoresistive accelerometer with a range more than kilo-g, in: Proceedings of the 6th International Conference on Solid-State and Integrated Circuit Technology, Shanghai, China, October 2001, pp. 804-807.
    • (2001) Proceedings of the 6th International Conference on Solid-State and Integrated Circuit Technology , pp. 804-807
    • Huang, Q.1    Lu, D.2
  • 6
    • 0028427601 scopus 로고
    • Fabrication and characterization of a twin-mass accelerometer
    • Chr. Burrer, J. Esteve, J.A. Plaza, M. Bao, Fabrication and characterization of a twin-mass accelerometer, Sens. Actuators A 43 (1994) 115-119.
    • (1994) Sens. Actuators A , vol.43 , pp. 115-119
    • Burrer, Chr.1    Esteve, J.2    Plaza, J.A.3    Bao, M.4
  • 7
    • 0041636178 scopus 로고    scopus 로고
    • Simple technology for bulk accelerometer based on bond and etch back silicon on insulator wafers
    • J.A. Plaza, J. Esteve, E. Lora-Tamayo, Simple technology for bulk accelerometer based on bond and etch back silicon on insulator wafers, Sens. Actuators A 68 (1998) 299-302.
    • (1998) Sens. Actuators A , vol.68 , pp. 299-302
    • Plaza, J.A.1    Esteve, J.2    Lora-Tamayo, E.3
  • 8
    • 0033881903 scopus 로고    scopus 로고
    • Twin-mass accelerometer optimization to reduce the package stresses
    • J.A. Plaza, J. Esteve, C. Cane, Twin-mass accelerometer optimization to reduce the package stresses, Sens. Actuators A 80 (2000) 199-207.
    • (2000) Sens. Actuators A , vol.80 , pp. 199-207
    • Plaza, J.A.1    Esteve, J.2    Cane, C.3
  • 9
    • 0036851963 scopus 로고    scopus 로고
    • Silicon micromachined high-shock accelerometers with a curved-surface-application structure for over-range stop protection and free-mode-resonance depression
    • Jian Dong, Xinxin Li, Yuelin Wang, Deren Lu, Shawkret Ahat, Silicon micromachined high-shock accelerometers with a curved-surface-application structure for over-range stop protection and free-mode-resonance depression, J. Micromech. Microeng. 12 (2002) 742-746.
    • (2002) J. Micromech. Microeng. , vol.12 , pp. 742-746
    • Dong, J.1    Li, X.2    Wang, Y.3    Lu, D.4    Ahat, S.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.