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Volumn 80, Issue 3, 2000, Pages 199-207

Twin-mass accelerometer optimization to reduce the package stresses

Author keywords

[No Author keywords available]

Indexed keywords

CANTILEVER BEAMS; FINITE ELEMENT METHOD; OPTIMIZATION; STRESS ANALYSIS; STRUCTURAL DESIGN; THERMAL STRESS;

EID: 0033881903     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-4247(99)00312-X     Document Type: Article
Times cited : (24)

References (16)
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  • 3
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    • Realization of mechanical zones for package-stress reduction
    • Spiering V.L., Bouwstra S., Fluitman J.H.J. Realization of mechanical zones for package-stress reduction. Sens. Actuators, A. 37-38:1993;800-804.
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    • Spiering, V.L.1    Bouwstra, S.2    Fluitman, J.H.J.3
  • 4
    • 0026909265 scopus 로고
    • Analysis on twin-mass structure for a piezoresistive accelerometer
    • Shen S., Chen J., Bao M. Analysis on twin-mass structure for a piezoresistive accelerometer. Sens. Actuators, A. 34:1992;101-107.
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    • Shen, S.1    Chen, J.2    Bao, M.3
  • 6
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    • Modeling of encapsulation stress effects on output response of hall sensors
    • Manku T., Nathan A., Aflatooni N.O.K., Allegretto W. Modeling of encapsulation stress effects on output response of hall sensors. Sens. Mater. 6(4):1994;225-234.
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  • 8
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    • Analytical and FEM modeling of piezoresistive silicon accelerometers: Predictions and limitations compared to experiments
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    • (1992) Sens. Mater. , vol.4 , pp. 189-203
    • Tschan, T.1    De Rooij, N.2    Bezinge, A.3
  • 9
    • 0025419815 scopus 로고
    • Modeling of thermal and mechanical stresses in silicon microstructures
    • Pourahmadi F., Barth P., Petersen K. Modeling of thermal and mechanical stresses in silicon microstructures. Sens. Actuators. A21-A23:1990;850-855.
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    • Pourahmadi, F.1    Barth, P.2    Petersen, K.3
  • 10
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    • Characterization and modeling of silicon piezoresistive accelerometers fabricated with bipolar-compatible process
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  • 11
    • 0030182191 scopus 로고    scopus 로고
    • Low-cost accelerometers: Two examples in thick-film technology
    • Crescini D., Marioli D., Taroni A. Low-cost accelerometers: two examples in thick-film technology. Sens. Actuators, A. 55:1996;79-85.
    • (1996) Sens. Actuators, a , vol.55 , pp. 79-85
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  • 12
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    • A graphical representation of the piezoresistance coefficients in silicon
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  • 13
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    • Simple technology for bulk accelerometer based on BESOI wafers
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    • Plaza, J.A.1    Esteve, J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.