Planarization of a CMOS die for an integrated metal MEMS

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4979, Issue , 2003, Pages 137-144

  Lee, Hocheol ^a,b   Miller, Michele H ^a,c   Bifano, Thomas G ^a  

^a BOSTON UNIVERSITY   (United States)

^b NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

^c MICHIGAN TECHNOLOGICAL UNIVERSITY   (United States)

Author keywords

Chemical mechanical planarization; MEMS integration; MEMS mirror array; Polishing; Sputtering

Indexed keywords

ADAPTIVE OPTICS; CHEMICAL MECHANICAL POLISHING; ELECTROSTATICS; LIGHT MODULATORS; MICROELECTROMECHANICAL DEVICES; SEMICONDUCTING ALUMINUM COMPOUNDS; SILICON NITRIDE; SPUTTERING; SURFACE TOPOGRAPHY; THERMAL EFFECTS;

ALUMINUM INTERCONNECT PATTERN; CHEMICAL MECHANICAL PLANARIZATION; METAL MIRROR ARRAY; MICRO MIRROR ARRAY;

CMOS INTEGRATED CIRCUITS;

EID: 0041562457     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.472803     Document Type: Conference Paper

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