HIGH RATE PECVD TO REDUCE HILLOCK GROWTH IN ALUMINUM INTERCONNECTS.

Volumn , Issue , 1987, Pages 434-439

  van de Ven, E P ^a   Martin, R S ^a   Berman, M J ^a  

^a NOVELLUS SYSTEMS INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTEGRATED CIRCUITS - METALLIZING; PLASMAS - PROCESSING; SPUTTERING;

HILLOCK GROWTH REDUCTION; MULTILEVEL METALLIZATION SCHEMES; PLASMA-ENHANCED CHEMICAL VAPOR DEPOSITION (PECVD);

ALUMINUM AND ALLOYS;

EID: 0023174016     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)