The application of electrochemical metrologies for investigating chemical mechanical polishing of Al with a Ti barrier layer

Materials Chemistry and Physics

Volumn 82, Issue 2, 2003, Pages 444-451

  Chiu, Shao Yu ^a   Wang, Ying Lang ^b,c   Liu, Chuan Pu ^e   Lan, Jin Kun ^a   Ay, Chyung ^c   Feng, Ming Shiann ^a   Tsai, Ming Shih ^d   Dai, Bau Tong ^d  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

^c NATIONAL CHIAYI UNIVERSITY   (Taiwan)

^d NATIONAL NANO DEVICE LABORATORIES   (Taiwan)

^e NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Aluminum; Chemical mechanical polishing; Selectivity; Titanium

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CORROSION PROTECTION; ELECTROCHEMISTRY; OXIDATION; PH EFFECTS; SLURRIES; TITANIUM;

INTERLEVEL DIELECTRICS (ILD);

ALUMINUM;

EID: 0041508965     PISSN: 02540584     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0254-0584(03)00312-2     Document Type: Article

References (20)

1. J.F. Wang, A.R. Sethuraman, L.M. CooK, R.C. Kistler, G.P. Schwartz, Semicond. Int. 18 (1995) 117.
2. K. Kikuta, in: Proceedings of the International Electron Devices Meeting, A4-3-P, 1996, p. 161.
3. Kordic, C.A.H. Mutsaers, H. Lifka, M.N. Webster, in: Proceedings of the IEEE IITC, 1998, p. 70.
4. Joshi R.V. IEEE Electro Dev. Lett. 15(3):1993;129.
5. C.W. Kaanta, S.G. Bombardier, W.J. Cote, W.R. Hill, G. Kerszykoweki, J.E. Cronin, et al., in: Proceedings of the Eighth International VLSI Multilevel Interconnection Conference, 1881, p. 155.
6. M.A. Fury, D.L. Scherber, M.A. Stell, MRS Bull. (1995) 161.
7. Kallingal C.G., Duquette D.J., Murarka S.P. J. Electrochem. Soc. 145:1998;2074.
8. Steigerwald J.M., Murarka S.P., Gutmann R.J., Duqutte D.J. Mater. Chem. Phys. 41:1995;217.
9. Wrschka P., Hernandez J., Hsu Y., Kuan T.S., Oehrlein G.S., Sun H.J., Hansen D.A., King J., Fury M.A. J. Electrochem. Soc. 146:1999;2689.
10. P. Singer, Semicond. Int. 21 (1998) 46.
11. L. Peters, Semicond. Int. 21 (1998) 83.
12. R. Iggulden, et al., Solid State Technol. (1998) 37.
13. C.C. Yu, T.T. Doan, A.E. Laulusa, US Patent 5 209 816 (1993).
14. D.A. Jones, Principles and Prevention of Corrosion, 2nd ed., Prentice-Hall, Englewood Cliffs, NJ, 1996, pp. 94, 177, 183.
15. Kneer E.A., Raghunath C., Mathew V., Raghavan S. J. Electrochem. Soc. 144:1997;3041.
16. Carpio R., Farkas J., Jairath R. Thin Solid Films. 266:1995;238.
17. J.A. Franklin, Atlas of Electrochemical Equilibria, 2nd ed., Pergamon Press, Oxford, 1974, pp. 158, 213.
18. Zeidler D., Stavreva Z., Plotner M., Drescher K. Microelectron. Eng. 33:1997;259.
19. Steigerwald J.M., Duqutte D.J., Murarka S.P., Gutmann R.J. J. Electrochem. Soc. 142:1995;2379.
20. Evans D.R. Electrochem. Soc. Proc. 96-22:1997;70.