Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials

Journal of Electronic Materials

Volumn 30, Issue 4, 2001, Pages 415-421

  Zhao, J ^a   Mutoh, Y ^a   Miyashita, Y ^a   Ogawa, T ^b   McEvily, A J ^c  

^a NAGAOKA UNIVERSITY OF TECHNOLOGY   (Japan)

^b AOYAMA GAKUIN UNIVERSITY   (Japan)

^c UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

Crack path; Creep effect; Fatigue crack growth; Solder; Stress ratio

Indexed keywords

CRACK PROPAGATION; CRACKS; CREEP; EUTECTICS; FATIGUE OF MATERIALS; STRESS ANALYSIS; THERMAL EFFECTS;

INTERGRANULAR CRACK GROWTH;

SOLDERING ALLOYS;

EID: 0035305462     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-001-0053-8     Document Type: Article

References (21)

1. S. Vaynman, G. Ghosh, and M.E. Fine, J. Electron. Mater. 27, 1223 (1998).
2. G. Ghosh, J. Electron. Mater. 27, 1154 (1998).
3. R. Sandstrom, J.-O. Osterberg, and M. Nylen, Mater. Sci. and Technol. 9, 811 (1993).
4. J.K. Tien, B.C. Hendrix, and A.I. Attarwala, IEEE Trans. CHMT 12, 502 (1989).
5. S. Vaynman, M.E. Fine, and D.A. Jeannotte, Metall. Trans. A 19, 1051 (1988).
6. R. Berriche, M.E. Fine, and D.A. Jeannotte, Metall. Trans. A 22, 357 (1991).
7. D.R. Frear, J.B. Posthill, and J.W. Morris, Jr., Metall. Trans. A 20, 1325 (1989).
8. D. Frear, D. Grivas, and J.W. Morris, Jr., J. Electron. Mater. 17, 171 (1988).
9. W.A. Logsdon, P.K. Liaw, and M.A. Burke, Eng. Fracture Mechan. 36, 183 (1990).
10. H.D. Solomon, The Mechanics of Solder Alloy Interconnects, ed. D.R. Frear et al. (New York: Van Nostrand Reinhold, 1994), p. 199.
11. H.D. Solomon, Solder Joint Reliability, ed. J.H. Lau (New York: Van Nostrand Reinhold, 1991), p. 406.
12. Z. Guo and H. Conrad, J. Electron. Pkg. 115, 159 (1993).
13. W.H. Cubberly et al., Metals Handbook Ninth Edition, Vol. 2 (Metals Park, OH: ASM, 1979), pp. 500, 617.
14. G.A. Clarke and J.D. Landes, J. Testing and Eval. 7, 264 (1979).
15. G.R. Irwin, Fracture, Handbuch der Physik VI, ed. S. Flugge (Berlin: Springer, 1958), pp. 551-590.
16. D.S. Dugdale, J. Mechs. and Phys. of Solids 8, 100 (1960).
17. V. Raman and T.C. Reiley, Scripta Metall. 20, 1343 (1986).
18. V. Raman and T.C. Reiley, Metall. Trans. A 19A, 1533 (1988).
19. D. Tribula, D. Grivas, D.R. Frear, and J.W. Morris, Jr., J. Electron. Pkg. 111, 83 (1989).
20. Z. Mei, J.W. Morris, Jr., M.C. Shine, and T.S. E. Summers, J. Electron. Mater. 20, 599 (1991).
21. D. Hardwick, C.M. Sellars, and W.J.McG. Tegart, J. Inst. Metals 90, 21 (1961-62).