Warpage and interracial stress distribution in a single-level integrated module (SLIM)

Journal of Electronic Packaging, Transactions of the ASME

Volumn 119, Issue 3, 1997, Pages 197-203

  Dunne, R C ^a   Sitaraman, S K ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; FRACTURE TOUGHNESS; INTERFACES (MATERIALS); SHEAR STRESS; STRESS CONCENTRATION; THERMAL STRESS;

MULTILAYERED SUBSTRATES; WARPAGE;

SUBSTRATES;

EID: 0031235704     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792234     Document Type: Article

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