Reduction of solder defects under nitrogen

SMT Surface Mount Technology Magazine

Volumn 12, Issue 1, 1998, Pages 56-58

  Hsiao, H ^a   Lin, J R ^a   Chang, E K ^a   Adams, S M ^a  

^a BOC Gases   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

MANUFACTURE; NITROGEN; OXYGEN; SOLDERING ALLOYS;

SOLDER DEFECT REDUCTION;

SOLDERING;

EID: 0031703859     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (6)

1. C. Lea, "Inert IR/Reflow: The Significance of Oxygen Concentration in Nitrogen and Nitrogen-Hydrogen Atmospheres," Proceedings of Surface Mount International '91, San Jose, Calif.
2. P.F. Stratton, et.al., "Effect of Adventitious Oxygen on Nitrogen-Inerted IR Reflow Soldering with Low-Residue Pastes," Soldering and Surface Mount Technology, No. 13, 1993.
3. R.J. Klein Wassink, et.al., "The Use of Nitrogen in Reflow Soldering," Proceedings of Surface Mount International '93, San Jose, Calif.
4. D.E. Anderson, "Benefits of Inerting a No-Clean Wave Soldering Process," IPC National No-Clean Conference, May 1993.
5. L. Hymes and T. Pitsch, "Process Cost Benefits When Soldering with No-Clean Fluxes in an Inert Atmosphere," IPC National No-Clean Conference, May 1993.
6. J.E. Alpeter, "Inert Gas Wave Soldering Evaluation," Conference on Elimination of Cleaning of Electronic Circuits After Solder Assembly, Sandia, Albuquerque, N.M. 1993.