Positron-defect profiling in Cd1-xZnxTe wafers after saw cutting

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 583-585

  McNeil, Sean P ^a   Lynn, Kelvin G ^a   Weber, Marc H ^a   Szeles, Csaba ^b   Soundararajan, Raji ^a  

^a WASHINGTON STATE UNIVERSITY   (United States)

^b II VI Inc   (United States)

Author keywords

CdZnTe; Defects; Depth profile; Positrons; Saw cutting; Semiconductors; Surface damage

Indexed keywords

CHEMICAL POLISHING; CUTTING; DEFECTS; ETCHING; INGOTS; POSITRONS; SURFACE PROPERTIES;

CADMIUM ZINC TELLURIDE; POSITRON DEFECT PROFILING; POSITRON DEPTH PROFILING; SAW CUTTING; SURFACE DAMAGE;

SEMICONDUCTING CADMIUM COMPOUNDS;

EID: 0038790117     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0145-8     Document Type: Article

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