High performance RF passive integration on a Si smart substrate for wireless applications

ETRI Journal

Volumn 25, Issue 2, 2003, Pages 65-72

  Kim, Dong Wook ^a   Jeong, In Ho ^a   Lee, Jong Soo ^b   Kwon, Young Se ^c  

^a Telephus Inc   (South Korea)

^b Teltron Inc   (South Korea)

^c Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ANTENNAS; BUTENES; COPPER PLATING; ELECTRIC INDUCTORS; ELECTRONICS PACKAGING; INSERTION LOSSES; LOCAL AREA NETWORKS; PASSIVE NETWORKS; SILICA; SILICON WAFERS; TRANSMISSION LINE THEORY; WIRELESS TELECOMMUNICATION SYSTEMS;

BENZO CYCLO BUTENE; HANDHELD PHONES; RADIO FREQUENCY PASSIVE INTEGRATED DEVICES;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0038708531     PISSN: 12256463     EISSN: None     Source Type: Journal    
DOI: 10.4218/etrij.03.0102.0207     Document Type: Article

References (11)

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