Viscosity of a no-flow underfill during reflow and its relationship to solder wetting

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 163-166

  Morganelli, P ^a   Wheelock, B ^a  

^a Emerson and Cuming Company   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURING; DIELECTRIC LOSSES; DIFFERENTIAL SCANNING CALORIMETRY; FLIP CHIP DEVICES; PERMITTIVITY; RESINS; SOLDERED JOINTS; STRUCTURE (COMPOSITION); TEMPERATURE; THERMAL EFFECTS; VISCOSITY; WETTING;

MICRODIELECTROMETRY; REFLOW; UNDERFILL;

SOLDERING ALLOYS;

EID: 0034836661     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. Dielectric analysis of thermoset cure
2. The effect of stoichiometry on chain segment and ion mobility in partially polymerized epoxy systems