Novel reworkable fluxing underfill for board level assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 940-945

  Zhang, Zhuqing ^a   Li, Haiying ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHIP SCALE PACKAGES; DAMPING; DIFFERENTIAL SCANNING CALORIMETRY; FILLERS; FLIP CHIP DEVICES; FRACTURE TOUGHNESS; IMPACT RESISTANCE; MECHANICAL TESTING; OPTICAL INTERCONNECTS; PRINTED CIRCUIT BOARDS; RELIABILITY; THERMOANALYSIS;

AIR TO AIR THERMAL SHOCK; BALL GRID ARRAYS; BOARD LEVEL ASSEMBLY; DYNAMIC MECHANICAL ANALYZER; MECHANICAL SHOCK; REWORKABLE FLUXING UNDERFILL; THERMAL MECHANICAL ANALYZERS;

ELECTRONICS PACKAGING;

EID: 0038688971     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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