Reworkable no-flow underfills for flip chip applications

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 24, Issue 2, 2001, Pages 115-122

  Wang, Lejun ^a,b   Li, Haiying ^c   Wong, C P ^a,c  

^a IEEE   (United States)

^b INTEL CORPORATION   (United States)

^c Georgia Institute of Technology   (United States)

Author keywords

Compress flow underfill; Flip chip; Flux underfill; No flow underfill; Reworkable underfill

Indexed keywords

COMPRESS FLOW UNDERFILL; FLUX UNDERFILL; NO FLOW UNDERFILL; REWORKABLE UNDERFILL;

CURING; FLIP CHIP DEVICES; GLASS TRANSITION; INTEGRATED CIRCUITS; PRINTED CIRCUIT BOARDS; SEMICONDUCTING SILICON; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; TEMPERATURE; THERMAL EXPANSION;

ELECTRONICS PACKAGING;

EID: 0035301165     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/6104.930962     Document Type: Article

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