Chip scale packaging reliability

International Symposium on Electronic Materials and Packaging, EMAP 2000

Volumn , Issue , 2000, Pages 398-405

  Quinones, Horatio ^a   Babiarz, Alec ^a  

^a Asymtek Headquarters   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BALL GRID ARRAYS; DYNAMIC LOADS; ELECTRONICS PACKAGING; FAILURE (MECHANICAL); FLIP CHIP DEVICES; HEAT SINKS; INTEGRATED CIRCUIT INTERCONNECTS; INTERMETALLICS; MODIFIED ATMOSPHERE PACKAGING; OUTAGES; RELIABILITY; SEMICONDUCTOR DEVICE TESTING; SOLDERED JOINTS; SOLDERING ALLOYS; VIBRATIONS (MECHANICAL);

CERAMIC BALL GRID ARRAYS; ENCAPSULATION PROCESS; FLIP CHIP TECHNOLOGIES; PLASTIC BALL GRID ARRAYS; RELIABILITY PERFORMANCE; SOLDER INTERCONNECTIONS; TEMPERATURE EXCURSIONS; TESTING QUALIFICATIONS;

CHIP SCALE PACKAGES;

EID: 0037739159     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2000.904188     Document Type: Conference Paper

References (9)

1. Beckman, K., A. Kolman et al, "Solder Interconnections Structures for Joining Semiconductors Devices to Substrates," U.S. Patent 4,604,644 (August 1986).
2. Quinones, H., "Underfill Reliability, Why Underfilling Flip-Chip Improves Reliability", Flip Chip and Ball Grid Array Conference in Singapore, Center for management technology, April 1994.
3. Manson, S.S., Thermal Stress and Low Cycle Fatigue, McGraw-Hill, New York, 1966.
4. Quinones, H., K. Puttlitz, "Flip Chip Solder Interconnections: A Reliability Perspective," Packaging Conference, Orlando Fl, 1996.
5. Quinones, H., "Solder Cyclic Creep Modeling'", Packaging IBM-ITL, Endicott NY, 1987.
6. Frost, H. J., "Mechanical Testing and Primary Creep on Pb/Sn Alloys," Darmoutth College Report, March 1986.
7. DiGiacomo, G., "EPX Underfill Static Creep Evaluation," IBM internal report, 1992.
8. EMRC, Non-linear Transient Analysis using FEM, Theoretical Manual, 1994.
9. Schwiebert, M. K. and W. H. Leong, "Underfill Flow as Viscous Flow Between Parallel Plates Driven by Capillary Action", ISHM Proceedings, October 1995