Non-linear temperature compensation for a micromachined bi-directional thermal flow sensor

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 510-513

  Chavan, Abhi V ^a   Prawdzik, D ^a   Manlove, G ^a   Long, S ^a   Dubois, P ^a   Dewes, B ^a  

^a DELPHI CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AUTOMOTIVE INDUSTRY; GAIN CONTROL; HEAT CONVECTION; INTERFACES (MATERIALS); LAMINAR FLOW; MICROMACHINING; NUSSELT NUMBER; REYNOLDS NUMBER; SURFACE STRUCTURE; THERMAL EFFECTS; THERMODYNAMIC PROPERTIES; TURBULENT FLOW;

TEMPERATURE COEFFICIENT OF SENSITIVITY; TEMPERATURE COEFFICIENT OFFSET; TEMPERATURE COMPENSATION; THERMAL FLOW SENSOR;

MICROSENSORS;

EID: 0038494033     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. T.R.Ohnstein, et al., 'Environmentally Rugged, wide dynamic range microstructure airflow sensor', Dig. IEEE Solid-State Sensor and Actuator Workshop, Hilton Head, 1990.
2. Eusik Yoon, K.D.Wise, 'An integrated Mass Flow Sensor with On-chip CMOS Interface Circuitry', IEEE Trans. Electron Devices, Vol. 39, No.6, June 1992, pp 1376-1386.
3. Yong Xu et.al. 'Mass Flowmeter Using a Multi-Sensor Chip', Proc. IEEE Int. Conf. MEMS 2000, pp541-546.
4. P. Malcovati et al., 'Combined air humidity and flow CMOS microsensor with on-chip 15 bit sigma-delta A/D', Dig. Symp. on VLSI Circuits, 1995, pp 45-46.
5. Flowmerics Inc, MA 01772, USA.
6. International Electrochemical Commision Standard 751.