Electron backscatter diffraction for studies of localized deformation

TMS Annual Meeting

Volumn , Issue , 2003, Pages 329-336

  Geiss, R H ^a   Roshko, A ^a   Bertness, K A ^a   Keller, R R ^a  

^a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BACKSCATTERING; CRYSTALLOGRAPHY; ELASTICITY; ELECTRON DIFFRACTION; GRAIN BOUNDARIES; GRAIN GROWTH; MULTILAYERS; PLASTIC DEFORMATION; STRAIN; THERMAL EXPANSION;

ELASTIC DEFORMATIONS; ELASTIC STRAINS;

ALUMINUM ALLOYS;

EID: 0038383006     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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9. R. R. Keller, R. Mönig, C. A. Volkert, E. Arzt, R. Schwaiger, and O. Kraft, "Interconnect Failure due to Cyclic Loading," Stress-Induced Phenomena in Metallization: Sixth International Workshop, ed. S. P. Baker, M. A. Korhonen, E. Arzt, and P. S. Ho, (Melville, NY: American Institute of Physics, 2002), 119-132.
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