Removal of heavy organics by supercritical CO2

Solid State Phenomena

Volumn 92, Issue , 2003, Pages 301-304

  Sehgal, A ^a   Yalamanchili, M R ^a   Millet, C ^b   Danel, A ^c   Tardif, F ^c  

^a Akrion   (United States)

^b Altis Semiconductor   (France)

^c CEA GRENOBLE   (France)

Author keywords

Post etch cleaning; Resist stripping

Indexed keywords

CARBON DIOXIDE; ETCHING; ORGANIC CHEMICALS; PHOTORESISTS; REMOVAL; SUPERCRITICAL FLUIDS;

HEAVY ORGANICS REMOVAL; POST ETCH CLEANING; RESIST RESIDUE; SUPERCRITICAL CARBON DIOXIDE; HEAVY ORGANICS; IN COMPOSITIONS; LAYER BY LAYER; POLYMER REMOVAL; POST-ETCH CLEANING; RESIST STRIPPING; SUPERCRITICAL; SUPERCRITICAL CO2;

CHEMICAL CLEANING; CLEANING;

EID: 0038377578     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: None     Document Type: Conference Paper

References (5)

1. 2 Based Stripping with Porous Ultra Low k Materials and Copper", This conference, Sep. 2002.
2. L Rothman et al., "Supercritical Fluid Processes for Photoresist Stripping", 2002 Wafer Cleaning & Surface Preparation Workshop, ISMT, May 2002.
3. P. Czuprynski et al., J. Vac. Sci. Technol. B, Vol. 16, No. 1, p. 147 (Jan/Feb. 1998)
4. F. H. Bell and O. Joubert, ibid, Vol. 15, No. 1, p. 88 (Jan/Feb. 1997)
5. O. Joubert et al., ibid, Vol. 15, No. 3, p. 629 (May/Jun. 1997).