Wire pull on fine pitch pads: an obsolete test for first bond integrity?

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2000, Pages 416-420

  Sundararaman, V ^a   Edwards, D R ^a   Subido, W E ^a   Test, H R ^a  

^a TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BOND STRENGTH (MATERIALS); CRACK PROPAGATION; FAILURE ANALYSIS; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; STRESS ANALYSIS; STRESS CONCENTRATION;

FINE PITCH PADS; INTERLAYER DIELECTRIC; SILICON TECHNOLOGY DEVICES; WIRE PULL TEST;

WIRE;

EID: 0034482058     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)