Influence of additives upon nucleation and growth of copper on titanium substrates during electrodeposition

Materials Science Forum

Volumn 426-432, Issue 4, 2003, Pages 3715-3720

  Seol, Kyeong Won ^a   Choe, Byung Hak ^b   Lee, Ye Kun ^c   Lee, Jong K ^d  

^a Chonbuk National University   (South Korea)

^b Gangneung Wonju National University   (South Korea)

^c Doosan Corporation   (South Korea)

^d MICHIGAN TECHNOLOGICAL UNIVERSITY   (United States)

Author keywords

Additive; Copper; Electrodeposition; Electron Tunneling; Oxide; Titanium Substrate

Indexed keywords

ADDITIVES; COPPER; ELECTRODEPOSITION; ELECTRON TRANSITIONS; NUCLEATION; SUBSTRATES; TITANIUM;

PIPE TUNNELING;

CRYSTAL GROWTH;

EID: 0038337724     PISSN: 02555476     EISSN: 16629752     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/msf.426-432.3715     Document Type: Conference Paper

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