The influence of chloride and glue on copper electrocrystallization on titanium for thin film applications

4th International Conference COPPER 99-COBRE 99

Volumn , Issue , 1999, Pages 495-509

  Dutra, A J B ^a   O'Keefe, T J ^b  

^a FEDERAL UNIVERSITY OF RIO DE JANEIRO   (Brazil)

^b MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CHLORINE COMPOUNDS; COMPOSITION EFFECTS; CRYSTALLIZATION; ELECTROCHEMISTRY; ELECTROLYTES; ELECTROPLATING; GLUES; MORPHOLOGY; NUCLEATION; SCANNING ELECTRON MICROSCOPY; TITANIUM; X RAY DIFFRACTION ANALYSIS;

CHLORIDE; ELECTROCRYSTALLIZATION; ELECTROLYTE STIRRING; NUCLEI DENSITY;

COPPER;

EID: 0033489479     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (17)

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