Evaluating and monitoring nucleation and growth in copper foil

JOM

Volumn 54, Issue 4, 2002, Pages 37-41

  Lee, Ye Kun ^a   O’Keefe, Thomas J ^a  

^a MISSOURI UNIVERSITY OF SCIENCE AND TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; ELECTROLYSIS; ELECTROLYTES; METAL FOIL; NUCLEATION; POLARIZATION; SCANNING ELECTRON MICROSCOPY;

COPPER FOIL;

ELECTRODEPOSITION;

EID: 0036530695     PISSN: 10474838     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02701655     Document Type: Review

References (19)

1. Structure and morphology of the surface of copper foil
2. Copper nucleation on titanium for thin film applications
3. Defect structure of electrodeposits
4. Production of thin copper foils on microporous titanium oxide substrates
5. The effect of additives on the nucleation and growth of copper onto stainless steel cathodes
6. Electrodeposition of copper on plasma and thermally oxidized titanium substrates
7. An attempt to quantify electrodeposit metallographic growth structure
8. Surface morphology of electrodeposits
9. Nucleation and growth of copper electrodeposits on titanium substrates
10. Thermal response of electrodeposited copper
11. Nucleation and initial growth of copper electrodeposits under galvanostatic conditions
12. The basic mechanisms of metal deposition and the role of additives