Fabrication of capacitive micromachined ultrasonic transducers (CMUTs) using wafer bonding technology for low frequency (10 kHz-150 kHz) sonar applications

Oceans Conference Record (IEEE)

Volumn 4, Issue , 2002, Pages 2322-2327

  Huang, Y ^a   Ergun, A S ^a   Haeggstrom E ^a   Khuri Yakub, B T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FREQUENCIES; MICROMACHINING; SILICON ON INSULATOR TECHNOLOGY; SONAR;

WAFER BONDING;

ULTRASONIC TRANSDUCERS;

EID: 0038306416     PISSN: 01977385     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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