Experimental study of the microstructure and stress of electroplated gold for microsystem applications

Journal of the Electrochemical Society

Volumn 150, Issue 6, 2003, Pages

  Kelly, J J ^a   Yang, N ^a   Headley, T ^b   Hachman, J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADDITION REACTIONS; ARSENIC; GOLD; GRAIN BOUNDARIES; MICROSTRUCTURE; RESIDUAL STRESSES; STRESS RELAXATION; THALLIUM; THIN FILMS;

ELECTROPLATED GOLD; FILM GRAIN SIZE; GOLD MICROSCTRUCTURE;

ELECTROPLATING;

EID: 0038269212     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.1573197     Document Type: Article

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