Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry

Journal of Electronic Materials

Volumn 32, Issue 6, 2003, Pages 531-534

  Donthu, Suresh K ^a   Vora, Mehul M ^a   Lahiri, S K ^a   Thompson, Carl V ^a,b   Yi, S ^a  

^a SINGAPORE MIT ALLIANCE   (Singapore)

^b Massachusetts Institute of Technology Cambridge   (United States)

Author keywords

Copper; DSC; Electroplating; Self annealing

Indexed keywords

ACTIVATION ENERGY; ANNEALING; DIFFERENTIAL SCANNING CALORIMETRY; DIFFUSION; ELECTROPLATING; GRAIN BOUNDARIES; GRAIN GROWTH; MICROSCOPIC EXAMINATION; NUCLEATION; REACTION KINETICS; RECRYSTALLIZATION (METALLURGY); THIN FILMS;

ELECTROPLATED COPPER FILMS; GRAIN BOUNDARY DIFFUSION;

COPPER;

EID: 0038160334     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-003-0138-7     Document Type: Article

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