Guidelines for structural and material-system design of a highly reliable 3D die-stacked module with copper through-vias

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 597-602

  Tanaka, Naotaka ^a   Yamaji, Yasuhiro ^a   Sato, Tomotoshi ^a   Takahashi, Kenji ^a  

^a ASSOCIATION OF SUPER ADVANCED ELECTRONICS TECHNOLOGIES ASET   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; COPPER; DEFECTS; FINITE ELEMENT METHOD; GOLD; INTERCONNECTION NETWORKS; PRINTED CIRCUIT DESIGN; RESINS; SILICON WAFERS; STRESS CONCENTRATION; THERMAL CYCLING; THERMAL EXPANSION;

DIE STACKED MODULE; SILICON DIES; THERMAL FATIGUE; THERMAL MISMATCH; ULTRA THIN DIES;

ELECTRONICS PACKAGING;

EID: 0038012721     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)

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9. N. Tanaka et al., "Mechanical effects of Copper through-via in a 3D Die-stacked Module", Proc. 52nd Electron. Components and Technol. Conf., San Diego, CA., May. 2002.