Alternative Z-axis connector technologies for high-density 3-D packaging

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2002, Pages 1106-1109

  Spiesshoefer, S ^a   Schaper, L ^a   Maner, K ^a   Porter, E ^a   Barlow, F ^a   Glover, M ^a   Marsh, William ^b   Bates, G ^b   Lucas, M ^b  

^a UNIVERSITY OF ARKANSAS   (United States)

^b NORTHROP GRUMMAN CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELASTOMERS; ELECTRIC CONNECTORS; ELECTRONIC EQUIPMENT MANUFACTURE; GOLD; HEAT TRANSFER; METALLIZING; PLASTIC FILMS; SUBSTRATES; WIRE;

CERAMIC SUBSTRATES; STACKED SUBSTRATE ASSEMBLIES;

CHIP SCALE PACKAGES;

EID: 0036287260     PISSN: 05695503     EISSN: None     Source Type: Journal    
DOI: 10.1109/ECTC.2002.1008240     Document Type: Article

References (7)

1. Z-axis interconnections for high density processors, Part 1
2. Z-Axis interconnection for 3-D high density packaging