Using PDMS microtransfer molding (μTM) for polymer flip chip

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 652-657

  Wong, Cell K Y ^a   Cheung, Otto C T ^a   Xu, Bing ^a   Yuen, Matthew M F ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; CONDUCTIVE PLASTICS; DEPOSITION; ELECTRIC RESISTANCE; FLIP CHIP DEVICES; SHEAR STRENGTH; SILICONES; SILVER; TRANSFER MOLDING; WETTING;

MICROTRANSFER MOLDING; POLYDIMETHYLSILOXANE; POLYMER BUMPING; POLYMER FLIP CHIP BUMPS; SILVER EPOXY PASTE;

INTEGRATED CIRCUIT MANUFACTURE;

EID: 0038012671     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

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2. Oh, K. W., Ahn, C. H., "A new flip-chip bonding technique using micromachined conductive polymer bumps," IEEE Trans-CPMT-B, Vol. 22, No. 4 (1999), pp. 586-591.
3. Kulesza, F. W., Estes, R.H., "Assembling Smart Cards with Polymer Flip Chip Technology" Electronic Packaging Production, Dec 1997.
4. Brittain, S.T.; Sugimura, Y.; Schueller, O.J.A.; Evans, A.G.; Whitesides, G.M., "Fabrication and mechanical performance of a mesoscale space-filling truss system," Journal of Microelectromechanical Systems, Vol. 10 No. 1 (2001), pp. 113-120.
5. Arias, F.; Oliver, S.R.J.; Xu, B.; Holmlin, R.E.; Whitesides, G.M., "Fabrication of metallic heat exchangers using sacrificial polymer mandrils," Journal of Microelectromechanical Systems, Vol. 10 No. 1 (2001), pp. 107-112.
6. Zhao, X. M.; Smith, S.P.; Prentiss, M.; Whitesides, G.M. "Fabrication Of Waveguide Couplers Using Microtransfer Molding," Proc. 1997 Lasers and Electro-Optics, 1997, Vol. 11, pp. 22-23.