|
|
|
Volumn 37, Issue 16, 1997, Pages 39-40,-42,-44
|
|
Assembling smart cards with polymer flip chip technology
a
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
DIELECTRIC MATERIALS;
ELECTRONICS PACKAGING;
EXCIMER LASERS;
MICROPROCESSOR CHIPS;
PHOTODETECTORS;
PROM;
PROTECTIVE COATINGS;
SEMICONDUCTING POLYMERS;
SMART CARDS;
SUBSTRATES;
FINE RESOLUTION SCREEN PRINTERS;
POLYMER FLIP CHIP INTERCONNECTION METHOD;
POLYMER FLIP CHIP TECHNOLOGY;
SMART CARD PACKAGING;
FLIP CHIP DEVICES;
|
|
EID: 0031334304
PISSN: 00134945
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
|
Times cited : (2)
|
|
References (0)
|
