Effect of microstructure on diffusion of copper in TiN films

Journal of Applied Physics

Volumn 93, Issue 9, 2003, Pages 5210-5214

  Gupta, A ^a   Wang, H ^a   Kvit, A ^a   Duscher, G ^a,b   Narayan, J ^a  

^a North Carolina State University   (United States)

^b OAK RIDGE NATIONAL LABORATORY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FILM GROWTH; MICROSTRUCTURE; PULSED LASER DEPOSITION; SECONDARY ION MASS SPECTROMETRY; SYNTHESIS (CHEMICAL); TITANIUM NITRIDE; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION;

ELECTRON ENERGY-LOSS SPECTROSCOPY;

METALLIC FILMS;

EID: 0037986666     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.1566472     Document Type: Article

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