Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4830, Issue , 2002, Pages 287-289

  Lee, J M ^a   Cho, S H ^a   Park, J G ^b   Lee, S H ^b   Han, Y P ^c   Kim, S Y ^c  

^a Laser Application Group   (South Korea)

^b Hanyang University   (South Korea)

^c SAMSUNG Electronics   (South Korea)

Author keywords

Adhesion force; CMP; Dry cleaning; Plasma shock wave; Shock cleaning; Silicon wafer; Slurry

Indexed keywords

CHEMICAL MECHANICAL POLISHING; DRY CLEANING; LASER APPLICATIONS; PLASMA SHOCK WAVES; SILICA; SLURRIES;

SHOCK CLEANING;

SILICON WAFERS;

EID: 0037960105     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.486511     Document Type: Conference Paper

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