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Volumn , Issue , 2003, Pages 56-59

A novel electrostatic vertical comb actuator fabricated on (111) silicon wafer

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; BONDING; OPTIMIZATION; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; SILICON WAFERS;

EID: 0037818353     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (20)

References (6)
  • 4
    • 0010952382 scopus 로고    scopus 로고
    • A novel electrostatic vertical actuator fabricated in one homogeneous silicon wafer using extended SBM technology
    • J. Kim, S. Park, and D. Cho, "A Novel Electrostatic Vertical Actuator Fabricated in one Homogeneous Silicon Wafer Using Extended SBM Technology," Transducers'01, Munich, Germany, June 2001, vol. 1, pp. 756-759.
    • Transducers'01, Munich, Germany, June 2001 , vol.1 , pp. 756-759
    • Kim, J.1    Park, S.2    Cho, D.3
  • 6
    • 0036734075 scopus 로고    scopus 로고
    • A boron etch-stop assisted lateral silicon etching process for improved high-aspect-ratio silicon micromachining and its applications
    • J. Hsieh and W. Fang, "A Boron Etch-stop Assisted Lateral Silicon Etching Process for Improved High-Aspect-Ratio Silicon Micromachining and Its Applications," Journal of Microelectromechanical Systems, vol. 12, pp. 574-581, 2002.
    • (2002) Journal of Microelectromechanical Systems , vol.12 , pp. 574-581
    • Hsieh, J.1    Fang, W.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.