New fabrication process for capacitive micromachined ultrasonic transducers

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 522-525

  Huang, Y ^a   Ergun, A S ^a   Haeggstrom E ^a   Khuri Yakub, B T ^a  

^a STANFORD UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; MICROMACHINING; SILICON ON INSULATOR TECHNOLOGY; SILICON WAFERS; SINGLE CRYSTALS; VACUUM APPLICATIONS;

CAPACITIVE MICROMACHINED ULTRASONIC TRANSDUCERS; WAFER BONDING TECHNIQUE;

ULTRASONIC TRANSDUCERS;

EID: 0037817770     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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