Endpoint detectable plating through femto-laser drilled glass wafers for three-dimentional electric interconnections

Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2003, Pages 638-641

  Li, Xinghua ^a   Abe, Takashi ^a,b   Esashi, Masayoshi ^a  

^a TOHOKU UNIVERSITY   (Japan)

^b JAPAN SCIENCE AND TECHNOLOGY AGENCY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; COPPER; DRILLING; ELECTRIC CURRENTS; ELECTRIC POTENTIAL; ELECTRONICS PACKAGING; ELECTROPLATING; ETCHING; GOLD; PULSED LASER APPLICATIONS; SEMICONDUCTING GLASS; THIN FILMS;

FEMTOSECOND LASER DRILLING; GLASS WAFER; THREE-DIMENSIONAL ELECTRIC INTERCONNECTION;

MICROELECTROMECHANICAL DEVICES;

EID: 0037817707     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

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