-
1
-
-
0032017693
-
Automatic fringe pattern analysis in experimental mechanics: A review
-
J. M. Huntely, “Automatic fringe pattern analysis in experimental mechanics: a review,” J. Strain Anal. 33, 105-125 (1998).
-
(1998)
J. Strain Anal.
, vol.33
, pp. 105-125
-
-
Huntely, J.M.1
-
2
-
-
85010176150
-
Phase shifting interferometers
-
D. Malacara, ed. (Wiley, New York,), Chap. 14
-
J. E. Greivenkamp and J. H. Bruning, “Phase shifting interferometers,” in Optical Shop Testing, D. Malacara, ed. (Wiley, New York, 1992), Chap. 14.
-
(1992)
Optical Shop Testing
-
-
Greivenkamp, J.E.1
Bruning, J.H.2
-
4
-
-
0033886020
-
Moire in atomic force microscope
-
H. Chen, D. Liu, and A. Lee, “Moire in atomic force microscope,” Exp. Tech. 24(1), 31-32 (2000).
-
(2000)
Exp. Tech.
, vol.24
, Issue.1
, pp. 31-32
-
-
Chen, H.1
Liu, D.2
Lee, A.3
-
5
-
-
0033880190
-
In-plane deformation measurement using the atomic force microscope moire method
-
H. Xie, S. Kishimoto, A. Asundi, G. B. Chai, N. Shinya, J. Yu, and B. K. A. Ngoi, “In-plane deformation measurement using the atomic force microscope moire method,” Nanotechnology 11(1), 24-29 (2000).
-
(2000)
Nanotechnology
, vol.11
, Issue.1
, pp. 24-29
-
-
Xie, H.1
Kishimoto, S.2
Asundi, A.3
Chai, G.B.4
Shinya, N.5
Yu, J.6
Ngoi, B.K.A.7
-
6
-
-
0003250147
-
Moire methods of strain analysis
-
5th ed., J. F. Doyle and J. W. Philips, ed. (Society for Experimental Mechanics, Bethel, Conn
-
F.-P. Chiang, “Moire methods of strain analysis,” in Manual on Experimental Stress Analysis, 5th ed., J. F. Doyle and J. W. Philips, ed. (Society for Experimental Mechanics, Bethel, Conn., 1989).
-
(1989)
Manual on Experimental Stress Analysis
-
-
Chiang, F.-P.1
-
7
-
-
0009770259
-
Thermal deformation measurement of electronic package using advanced moire methods
-
IEEE Catalog 00EX456 (Institute of Electrical and Electronics Engineers, New York,), pp
-
H. Xie, C. G. Boay, and A. Asundi, “Thermal deformation measurement of electronic package using advanced moire methods,” in The Third Electronics Packaging Technology Conference, 5-7 December 2000, Singapore, IEEE Catalog 00EX456 (Institute of Electrical and Electronics Engineers, New York, 2000), pp. 163-168.
-
(2000)
The Third Electronics Packaging Technology Conference, 5-7 December 2000, Singapore
, pp. 163-168
-
-
Xie, H.1
Boay, C.G.2
Asundi, A.3
-
8
-
-
0003713904
-
-
Springer-Verlag, New York, Appendix B
-
D. Post, B. Han, and P. Ifju, High Sensitivity Moire (Springer-Verlag, New York, 1994), Appendix B.
-
(1994)
High Sensitivity Moire
-
-
Post, D.1
Han, B.2
Ifju, P.3
-
9
-
-
0001550969
-
Multimode noise analysis of cantilevers for the scanning probe microscope
-
M. V. Salapaka, H. S. Bergh, J. Lai, A. Majumdar, and E. Mcfor-land, “Multimode noise analysis of cantilevers for the scanning probe microscope,” J. Appl. Phys. 71, 2480-2487 (1997).
-
(1997)
J. Appl. Phys.
, vol.71
, pp. 2480-2487
-
-
Salapaka, M.V.1
Bergh, H.S.2
Lai, J.3
Majumdar, A.4
Mc For-Land, E.5
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