Microstructure-controlled interdiffusion of Cu/Co/Au thin films investigated by three-dimensional atom probe

Materials Science and Engineering: A

Volumn 353, Issue 1-2, 2003, Pages 119-125

  Lang, Ch ^a   Schmitz, G ^a  

^a UNIVERSITY OF GÖTTINGEN   (Germany)

Author keywords

Cu Au; Diffusion barrier; Field ion microscopy; Grain boundary reaction; Interdiffusion; Nanocrystalline materials; Thin films; Tomographic atom probe

Indexed keywords

COBALT; COPPER; CRYSTAL ATOMIC STRUCTURE; GOLD; GRAIN BOUNDARIES; INTERDIFFUSION (SOLIDS); INTERMETALLICS; MICROSTRUCTURE; MULTILAYERS; SINGLE CRYSTALS; SUBSTRATES; TRANSMISSION ELECTRON MICROSCOPY;

FIELD ION MICROSCOPY (FIM);

THIN FILMS;

FILM; MICROSCOPY; MICROSTRUCTURE;

EID: 0037708441     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0921-5093(02)00677-9     Document Type: Article

References (16)

1. Gösele U. Tu K.N. J. Appl. Physiol. 66 1989 2619
2. d'Heurle F.M. Gas P. Philibert J. Def. Diff. Forum 143-147 1997 529
3. Pretorius R. de Reus R. Vredenberg A.M. Saris F.W. Mater. Lett. 9 1990 494
4. Bené R.W. J. Appl. Physiol. 61 1987 1826
5. Lang Ch. Schmitz G. Kirchheim R. Def. Diff. Forum. 194-199 2001 1525
6. Schleiwies J. Schmitz G. Heitmann S. Hütten A. Appl. Physiol. Lett. 78 2001 3439
7. Schleiwies J. Schmitz G. Mater. Sci. Eng. A 327 2002 94
8. Jeske T. Schmitz G. Kirchheim R. Mater. Sci. Eng. A 270 1999 64
9. Jeske T. Schmitz G. Mater. Sci. Eng. A 327 2002 101
10. Hartung F. Schmitz G. Phys. Rev. B 64 2001 245418
11. Minkwitz C. Herzig Chr. Rabkin E. Gust W. Acta. Mater. 47 1999 1231
12. Budke E. Surholt T. Prokofjew S.I. Shvindlerman L.S. Herzig Chr. Acta. Mater. 47 1999 385
13. Landolt-Börnstein, Diffusion in Solid Metals and Alloys, Group III, Vol. 26, Springer, Berlin, 1990.
14. Kaur I. Gust W. Kozma L. Handbook of Grain and Interphase Boundary Diffusion Data 1989 Ziegler Press Stuttgart
15. King H.W. J. Mater. Sci. 1 1966 79
16. Yoon D.N. Annu. Rev. Mater. Sci. 19 1989 43