Thermal stress analysis for rapid thermal processor

IEEE Transactions on Semiconductor Manufacturing

Volumn 16, Issue 2, 2003, Pages 335-341

  Chao, Ching Kong ^a   Hung, Shih Yu ^a   Yu, Cheng Ching ^b  

^a NATIONAL TAIWAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

^b NATIONAL TAIWAN UNIVERSITY   (Taiwan)

Author keywords

Cooling control; Rapid thermal processor; Thermal stress; Transient heat transfer

Indexed keywords

COOLING; FAILURE ANALYSIS; HEAT TRANSFER; SHEAR STRESS; STRAIN RATE; THERMAL STRESS; THERMOELASTICITY;

RAPID THERMAL PROCESSORS;

INTEGRATED CIRCUIT LAYOUT;

EID: 0037616286     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/TSM.2003.811884     Document Type: Article

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