Thermal uniformity of 12-in silicon wafer during rapid thermal processing by inverse heat transfer method

IEEE Transactions on Semiconductor Manufacturing

Volumn 13, Issue 4, 2000, Pages 448-456

  Lin, Senpuu ^a   Chu, Hsin Sen ^a  

^a NATIONAL CHIAO TUNG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

FINITE DIFFERENCE METHOD; HEAT FLUX; HEAT TRANSFER; MATHEMATICAL MODELS; MEASUREMENT ERRORS; SILICON WAFERS; TEMPERATURE MEASUREMENT; THERMODYNAMIC PROPERTIES;

INVERSE HEAT TRANSFER METHOD; TEMPERATURE DEPENDENT THERMAL PROPERTY; THERMAL UNIFORMITY;

RAPID THERMAL ANNEALING;

EID: 0034313446     PISSN: 08946507     EISSN: None     Source Type: Journal    
DOI: 10.1109/66.892631     Document Type: Article

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