Elastomer chip sockets for reduced thermal mismatch problems and effortless chip replacement, preliminary investigations

IEEE Transactions on Advanced Packaging

Volumn 26, Issue 1, 2003, Pages 33-40

  Norberg, Gunnar ^a,b   Dejanovic, Slavko ^a,b   Hesselbom, Hjalmar ^b  

^a Solectron Sweden AB   (Sweden)

^b MID SWEDEN UNIVERSITY   (Sweden)

Author keywords

Chip socket; Chip first; Flip chip; Multi chip modules; Packaging; Silicone elastomer; Thermal fatigue; Thermal stress

Indexed keywords

ELASTOMERS; FLIP CHIP DEVICES; INTEGRATED CIRCUIT LAYOUT; MULTICHIP MODULES; SEMICONDUCTING SILICON; THERMAL STRESS;

ELASTOMER CHIP SOCKETS; MICRO BUMP ARRAYS; SILICONE ELASTOMER; THERMAL FATIGUE; THERMOMECHANICAL STRESS;

ELECTRONICS PACKAGING;

EID: 0037604515     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2003.811362     Document Type: Article

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