Importance of material selection for flip chip on board assemblies

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1994, Pages 387-394

  O'Malley, Grace ^a   Giesler, Jan ^a   Machuga, Steve ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC WIRING; ENCAPSULATION; FLIP CHIP DEVICES; INTEGRATED CIRCUIT MANUFACTURE; MECHANICAL PROPERTIES; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT DESIGN; RELIABILITY; SCHEMATIC DIAGRAMS; SEMICONDUCTING SILICON; STRESSES; SUBSTRATES;

COMPATIBILITY; FLIP CHIP TECHNOLOGY; SILICON CHIP; SOLDER BUMP; THERMAL MISMATCH;

ELECTRONICS PACKAGING;

EID: 0027963789     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)