Proposal of new polishing technology without using a polishing pad

CIRP Annals - Manufacturing Technology

Volumn 51, Issue 1, 2002, Pages 255-258

  Lu, Y ^a   Tani, Y ^a   Kawata, K ^a  

^a INSTITUTE OF INDUSTRIAL SCIENCE   (Japan)

Author keywords

Mirror finishing; Polishing; Polymer particle

Indexed keywords

ABRASIVES; FRICTION; MACHINE TOOLS; MIRRORS; POLYMERS;

POLISHING PADS;

POLISHING;

EID: 0037501280     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0007-8506(07)61511-X     Document Type: Article

References (5)

1. Bhushan, M., Rouse, R., Lukens, J.E., 1995, Chemical-Mechanical Polishing in Semidirect Contact Mode, J. Electrochem. Soc., 142/11: 3845-3851.
2. Fury, M.A., 1995, Emerging Development in CMP for semiconductor planarization, Solid State Technology, 38/4: 47-54.
3. Sohn, I., S., Moudgll, B., Singh, R., Park, C., W., 2000, Hydrodynamics of a Chemical-Mechanical Planarization Process, Materials Research Society Symposium Proceedings, Vol.566: 181-186.
4. Velden, P.V., 2000, Chemical mechanical polishing with fixed abrasives using different subpads to optimise wafer uniformity, Microelectronic Engineering, 50/1:41-46.
5. Byrne, G, Mullany, B., Young, P., 1999, The effect of Pad Wear on the Chemical Mechanical Polishing of Silicon Wafers, Annals of the CIRP, 48/1:143-146.