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Adhesion problems in deep-etch X-ray lithography caused by fluorescence radiation from the plating base
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Enhanced adhesion buffer layer for deep X-ray lithography using hard X-rays
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Alternative resist adhesion and electroplating layers for LIGA process
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Beamline and station for deep X-ray lithography at the advanced photon source
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X-ray fabrication of nonorthogonal structures using 'surface' masks
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Evaluation of alternative development process for high-aspect-ratio poly(methylmethacrylate) microstructures in deep X-ray lithography
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Use of graphite substrates for deep X-ray lithography
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Microfabrication of freestanding metal structures released from graphite substrates
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IEEE MEMS, Las Vegas, NE, USA, January 20-24
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O.V. Makarova, C.-M. Tang, D.C. Mancini, N. Moldovan, R. Divan, D.G. Ryding, R.H. Lee, Microfabrication of freestanding metal structures released from graphite substrates, Technical Digest, IEEE MEMS, Las Vegas, NE, USA, January 20-24, 2002, pp. 400-402.
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11
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0010892202
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Development of freestanding copper anti-scatter grid using deep X-ray lithography
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accepted for publication
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O.V. Makarova, C.-M. Tang, D.C. Mancini, N. Moldovan, R. Divan, D.G. Ryding, R.H. Lee, Development of freestanding copper anti-scatter grid using deep X-ray lithography, Microsyst. Technol. (2002), accepted for publication.
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