Electrochemical behaviour and physical properties of Cu/Co multilayers

Electrochimica Acta

Volumn 48, Issue 8, 2003, Pages 1005-1013

  Gomez E ^a   Labarta, A ^a   Llorente, A ^a   Valles E ^a  

^a UNIVERSITY OF BARCELONA   (Spain)

Author keywords

Cobalt copper; Electrodeposition; Multilayers; Stripping

Indexed keywords

ATOMIC FORCE MICROSCOPY; COBALT; COPPER; ELECTROCHEMISTRY; ELECTRODEPOSITION; MAGNETORESISTANCE; OXIDATION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES;

POTENTIODYNAMIC STRIPPING;

MULTILAYERS;

EID: 0037420679     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0013-4686(02)00814-9     Document Type: Article

References (30)

1. I. Kirilova, I. Ivanov, S. Rashkov, J. Appl. Electrochem. 28 (1998) 637, 1359.
2. Jensen J.D., Gabe D.R., Wilcox G.D. Surf. Coat. Technol. 105:1998;240.
3. Chawa G., Wilcox G.D., Gabe D.R. Trans IMF. 76:1998;117.
4. Kalantary M.R., Wilcox G.D., Gabe D.R. Br. Corrosion J. 33:1998;197.
5. Herman A.M., Mansour M., Badri V., Pinkhasov B., Gonzales C., Fickett F., Calixto M.E., Sebastian P.J., Marshall C.H., Gillespie T.J. Thin Solid Films. 361-362:2000;74.
6. Pasa A.A., Schwarzacher W. Phys. Stat. Sol. 173:1999;73.
7. Toth Kadar E., Peter L., Becsei T., Schwarzacher W. J. Electrochem. Soc. 147:2000;3311.
8. Jyoko Y., Kashiwabara S., Hayashi Y., Schwarzacher W. Electrochem. Solid-State Lett. 2:1999;67.
9. Ueda Y., Houga T., Zaman H., Yamada A. J. Solid Stat. Chem. 147:1999;274.
10. Jyoko Y., Kashiwabara S., Hayashi Y., Schwarzacher W. J. Electrochem. Soc. 144:1997;L5.
11. Chassaing E., Nallet P., Trichet M.F. J. Physique IV. 6:1996;C7-13.
12. Schwarzacher W., Lashmore D.S. IEEE Trans. Magn. 32:1996;3133.
13. Suzuki M., Ohwaki T., Taga Y. Thin Solid Films. 304:1997;333.
14. El Fanity H., Rahmouni K., Bouanani M., Dinia A., Shmerber G., Meny C., Panissod P., Cziraki A., Cherkaoui F., Berrada A. Thin Solid Films. 318:1998;227.
15. M. Schlesinger, K.D. Bird, in: Paunovic (Ed.), The Electrochemical Society Proceedings, The Electrochemical Proceeding Series, Pennington, NJ, vol. 94-31, 1994, p. 97.
16. Shima M., Salamanca-Riba L., Moffat T.P., McMichael R.D. J. Mag. Mag. Mat. 198-199:1999;52.
17. Ueda Y., Kikuchi N., Ikeda S., Houga T. J. Mag. Mag. Mat. 198-199:1999;740.
18. Nallet P., Chassaing E., Walls M.G., Hytch M.J. J. Appl. Phys. 79:1996;6884.
19. Bradley P.E., Landolt D. Electrochim. Acta. 45:1999;1077.
20. Miyake T., Kume M., Yamaguchi K., Amalnerkar D.P., Minoura H. Thin Solid Films. 397:2001;83.
21. Jyoko Y., Schwarzacher W. Electrochim. Acta. 47:2001;371.
22. Kudo K., Kobayakawa K., Sato Y. Electrochim. Acta. 47:2001;353.
23. Gómez E., Llorente A., Vallés E. J. Electroanal. Chem. 495:2000;19.
24. Zaman H., Yamada A., Fukuda H., Ueda Y. J. Electrochem. Soc. 145:1998;565.
25. Gómez E., Labarta A., Llorente A., Vallés E. Surf. Coat. Technol. 153:2002;261.
26. Bubendorff J.L., Beaurepaire E., Mény C., Panissod P., Bucher J.P. Phys. Rev. B. 56:1997;R7120.
27. Cagnon L., Devolder T., Cortes R., Morrone A., Schmidt J.E., Chappert C., Allongue P. Phys. Rev. B. 63:2001;104419.
28. Kubinski D.J., Holloway H. J. Mag. Mag. Mat. 165:1997;104.
29. Suzuki M., Ohwaki T., Taga Y. Thin Solid Films. 304:1997;333.
30. Angiolini M., Carlotti G., Gubbiotti G., Montone A., Palmieri L., Pareti L., Turilli G., Vittori-Antisari M. J. Mag. Mag. Mat. 198-199:1999;462.