Development of a numerical simulation tool to study uniformity of large area PECVD film processing

Thin Solid Films

Volumn 427, Issue 1-2, 2003, Pages 21-26

  Sansonnens, L ^a   Bondkowski, J ^b   Mousel, S ^b   Schmitt, J P M ^b   Cassagne, V ^b  

^a EPFL   (Switzerland)

^b Displays Division   (France)

Author keywords

Plasma processing and deposition; Silicon nitride

Indexed keywords

COMPUTER SIMULATION; ELECTRODES; SILICON NITRIDE; THIN FILMS;

PLASMA REACTORS;

PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION;

EID: 0037416644     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(02)01175-6     Document Type: Conference Paper

References (12)

1. Schmitt J.P.M., Elyaakoubi M., Sansonnens L. Glow discharge processing in liquid crystal display industry. Plasma Sources Sci. Technol. 11:2002;A206.
2. Sansonnens L., Pletzer A., Magni D., Howling A.A., Hollenstein Ch., Schmitt J.P.M. Plasma Sources Sci. Technol. 6:1997;170.
3. L. Sansonnens, D. Franz, Ch. Hollenstein, A.A. Howling, J.P.M. Schmitt, E. Turlot, T. Emeraud, U. Kroll, J. Meyer, A. Shah, Proceedings 13th EC Photovoltaic Solar Energy Conference, 1995, p. 154.
4. Caquineau H., Dupont G., Despax B., Couderc J.P. J. Vac. Sci. Technol. A. 14:1996;2071.
5. Dollet A., Couderc J.P., Despax B. Plasma Sources Sci. Technol. 4:1995;94.
6. Yoo C.-S., Dixon A.G. AIChE J. 35:1989;995.
7. Collins D.J., Strojwas J., White D.D. Jr. IEEE Trans. Semiconduct. Manuf. 7:1994;176.
8. Kushner M.J. J. Appl. Phys. 82:1997;5312.
9. Greabel W.P. Engineering Fluid Mechanics. 2001;215-216 Taylor & Francis, Ltd, London.
10. Hirschfelder J.O., Curtiss C.F., Bird R.B. Molecular Theory of Gases and Liquids. 1954;Wiley, New York.
11. Perrin J., Leroy O., Bordage M.C. Contrib. Plasma Phys. 36:1996;3.
12. Available from http://www.pdesolutions.com.